300mm Cassette-less Cleaning System
Used in the chemical polishing process after final polishing / Batch processing of 50 pieces / Achieving high purity of 19nμm/5 pieces
<Equipment Overview> This device is used in the chemical polishing process after final polishing. Its feature is that it places 25 wafers in the gaps of 25 wafers, creating a half pitch, allowing for the simultaneous processing of 50 wafers. It achieves a high purity of 19nμm / 5 pieces.
- Company:ゼビオス(XEVIOS CORP.,)
- Price:Other